In recent years, China's annual import volume of integrated circuits (ICs) has consistently exceeded $200 billion, highlighting a heavy reliance on foreign imports and a significant imbalance between market supply and demand. Liu Bin, a senior expert at the 45th Institute of China Electronics Technology Group Corporation, emphasized that this dependency remains a critical challenge for the domestic semiconductor industry.
From a technological standpoint, China’s IC manufacturing lags behind global leaders by approximately two to three generations. This gap is particularly evident in the equipment used for production, which is still largely imported, making full localization difficult. While international manufacturers have already moved to 14-10nm process nodes, with front-end manufacturing reaching 7nm and preparing for mass production in 2018, China is expected to achieve 14nm volume production by 2019. The development of 3-5nm technology is still ongoing, further widening the gap.
Liu Bin noted that the disparity in semiconductor manufacturing equipment is not only due to technical limitations but also the inherent complexity of the field. Semiconductor equipment requires high technical expertise, long R&D cycles, and extensive process validation. These factors make it challenging for domestic companies to compete without strong government support, collaboration with downstream industries, and sustained investment.
The "Made in China 2025" initiative aims to boost the localization of IC manufacturing equipment. By 2020, the goal is to reach a 50% localization rate for 90-32nm equipment and key measurement tools. By 2025, 20-14nm equipment should reach 30% localization, and by 2030, China aims to fully localize 18-inch process equipment, EUV lithography machines, and packaging and testing systems.
To meet these goals, Liu Bin stressed the importance of six driving factors: market demand, security, self-reliance, industrial chain completeness, mission responsibility, and policy guidance. Market-driven R&D accounts for 60-70% of investment, while technology, capital, knowledge accumulation, and brand strength are key to building competitive advantages.
Beyond technical challenges, security risks such as “artificial back doors†in equipment have become a growing concern. As IC manufacturing becomes more networked, the risk of cyber threats increases. In the future, smart IC manufacturing may need to address security demands directly.
To reduce dependence on foreign suppliers, an autonomous and controllable industrial ecosystem must be developed. Liu Bin urged companies to focus on breakthroughs across the entire production line, specialized processes, and individual equipment. This will help China reduce its reliance on global supply chains.
Equipment plays a crucial role in building a complete industrial ecosystem. Liu Bin emphasized that semiconductors require not only advanced equipment but also integration capabilities. Companies in the national electronics manufacturing sector must take responsibility for developing the industry, ensuring a full supply chain, and meeting the needs of China’s semiconductor manufacturing.
With support from the government, industry, and local authorities, various plans have been launched to advance the IC industry. These initiatives focus on 14nm node technology, along with advancements in packaging, materials, and related fields. Over the past decade, more than 30 types of high-end equipment have been successfully developed, ending China’s previous lack of advanced IC equipment. This has helped establish and improve the manufacturing system for 55-28nm process technologies, creating several equipment manufacturers and attracting both domestic and international resources.
"In 2010, our equipment accounted for just 4% of the world market. In ten years, we’ve multiplied that five times," Liu Bin said. He added that while "Made in China 2025" presents great opportunities, it also brings significant challenges. CEC aims to develop core equipment for 28-14nm processes, achieve mass production, and break through 7-5nm technology, eventually getting core equipment listed in international procurement systems.
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