[Source: "High-tech LED" magazine March issue (total issue 63) | The same party general manager Yang Fan] 2014 is the year of LED lighting, the popularity of LED lighting will accelerate in 2015, it is expected that the output value of LED lighting will exceed the traditional Lighting has become a turning point in the lighting industry. At the same time, the integration of the LED industry will intensify, and mergers and acquisitions will be more. In 2014, some companies performed well, and some companies were bumpy. Overall, the first half of the year was hot, and the second half was cold.
In terms of the overall trend, the growth rate of the domestic packaging market in 2014 was not satisfactory, mainly due to the intensified competition in the industry and the sharp drop in gross profit margin.
However, if the growth of display screens, backlights, etc. is limited, the main growth is concentrated in the field of lighting, that is, concentrated in the field of white light. Therefore, in 2015, white light packaging is almost the only growth force, and competition will further intensify. The decline in gross profit margin will lead to further market reshuffle and wash off a large part of uncompetitive enterprises.
As the main light source for lighting applications, white-light packaged devices are in increasing demand in the international environment of energy saving and emission reduction, and the application fields are becoming more and more extensive. From the previous promotion by developed countries such as Europe, America, Japan and South Korea, the gradual transition to the increased demand of developing countries and the domestic market. At present, the current situation is that the market demand in Europe, America, Japan and South Korea has increased steadily, and the outbreaks of developing countries and domestic markets are coming. Therefore, the lighting market should have a huge outbreak in the increasingly fierce competition. Corresponding to the field of white light packaging will also be a huge opportunity.
Under the background of increasing market competition, the price decline of terminal lighting products is an inevitable trend. And falling prices will stimulate more market demand.
So for this market growth, price and cost will be the main consideration for many customers. In the case that everyone's craftsmanship is roughly the same, the details and local advantages become the key to winning more markets. For example, higher brightness, better heat dissipation, longer life, etc.
At the same time, the new packaging method is also the growth point of performance. In recent years, many research institutions and enterprises at home and abroad have continued to research LED packaging technology. Excellent packaging materials and efficient packaging technology have been proposed, and high-reliability LED lighting new products. Have appeared. For example, flip-chip, three-dimensional packaging, COB packaging, and the like.
Three-dimensional packaging technology is a new concept for LED packaging, which puts more innovative requirements on design ideas and concepts, material properties and packaging technology itself. From the emergence of today's three-dimensional printing technology, the LED three-dimensional packaging technology has become a possibility, but there are many problems that need to be overcome, such as composite preparation of materials, thermal stress balance control between materials, and production efficiency. Therefore, it can be said that LED packaging technology based on three-dimensional printing technology is still a distant idea.
The COB (Chip on Board) package structure is developed on the basis of multi-chip package technology. The COB package directly mounts the exposed chip on the circuit board, bonds the board through the bonding wires, and then performs the chip. Passivation and protection. The advantages of COB are: soft light, simple circuit design, high cost efficiency, saving system space, etc., but there are technical problems of chip integration brightness, color temperature adjustment and system integration. The main manufacturers: the same side photoelectric, Hongli, upgrade, etc. .
With the advent of 2015, the original advantages of the same party will continue to be the ultimate, such as COB, high-power devices. At the same time, we will develop new products to meet more markets. In the relevant test, the sample of the same side has the lowest thermal resistance and the lowest junction temperature.
With the continuous development of LED power, modularization, low cost, and high reliability, the requirements for packaging technology will become more and more demanding, especially for packaging materials and packaging processes. Packaging technology is more complex, and needs to consider optical, thermal, electrical, structural and other factors, while low thermal resistance, stable packaging materials and novel and excellent packaging structure are still the key to LED packaging technology.
In 2015, the same side of the company will launch a white light module, including light source, heat dissipation structure, secondary light distribution and other components, to facilitate customer use, in order to contribute to the development of LED.
In terms of the overall trend, the growth rate of the domestic packaging market in 2014 was not satisfactory, mainly due to the intensified competition in the industry and the sharp drop in gross profit margin.
However, if the growth of display screens, backlights, etc. is limited, the main growth is concentrated in the field of lighting, that is, concentrated in the field of white light. Therefore, in 2015, white light packaging is almost the only growth force, and competition will further intensify. The decline in gross profit margin will lead to further market reshuffle and wash off a large part of uncompetitive enterprises.
As the main light source for lighting applications, white-light packaged devices are in increasing demand in the international environment of energy saving and emission reduction, and the application fields are becoming more and more extensive. From the previous promotion by developed countries such as Europe, America, Japan and South Korea, the gradual transition to the increased demand of developing countries and the domestic market. At present, the current situation is that the market demand in Europe, America, Japan and South Korea has increased steadily, and the outbreaks of developing countries and domestic markets are coming. Therefore, the lighting market should have a huge outbreak in the increasingly fierce competition. Corresponding to the field of white light packaging will also be a huge opportunity.
Under the background of increasing market competition, the price decline of terminal lighting products is an inevitable trend. And falling prices will stimulate more market demand.
So for this market growth, price and cost will be the main consideration for many customers. In the case that everyone's craftsmanship is roughly the same, the details and local advantages become the key to winning more markets. For example, higher brightness, better heat dissipation, longer life, etc.
At the same time, the new packaging method is also the growth point of performance. In recent years, many research institutions and enterprises at home and abroad have continued to research LED packaging technology. Excellent packaging materials and efficient packaging technology have been proposed, and high-reliability LED lighting new products. Have appeared. For example, flip-chip, three-dimensional packaging, COB packaging, and the like.
Three-dimensional packaging technology is a new concept for LED packaging, which puts more innovative requirements on design ideas and concepts, material properties and packaging technology itself. From the emergence of today's three-dimensional printing technology, the LED three-dimensional packaging technology has become a possibility, but there are many problems that need to be overcome, such as composite preparation of materials, thermal stress balance control between materials, and production efficiency. Therefore, it can be said that LED packaging technology based on three-dimensional printing technology is still a distant idea.
The COB (Chip on Board) package structure is developed on the basis of multi-chip package technology. The COB package directly mounts the exposed chip on the circuit board, bonds the board through the bonding wires, and then performs the chip. Passivation and protection. The advantages of COB are: soft light, simple circuit design, high cost efficiency, saving system space, etc., but there are technical problems of chip integration brightness, color temperature adjustment and system integration. The main manufacturers: the same side photoelectric, Hongli, upgrade, etc. .
With the advent of 2015, the original advantages of the same party will continue to be the ultimate, such as COB, high-power devices. At the same time, we will develop new products to meet more markets. In the relevant test, the sample of the same side has the lowest thermal resistance and the lowest junction temperature.
With the continuous development of LED power, modularization, low cost, and high reliability, the requirements for packaging technology will become more and more demanding, especially for packaging materials and packaging processes. Packaging technology is more complex, and needs to consider optical, thermal, electrical, structural and other factors, while low thermal resistance, stable packaging materials and novel and excellent packaging structure are still the key to LED packaging technology.
In 2015, the same side of the company will launch a white light module, including light source, heat dissipation structure, secondary light distribution and other components, to facilitate customer use, in order to contribute to the development of LED.
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