[High-tech LED News] Recently, Anhui Ryder Optoelectronics Technology Co., Ltd. successfully developed a flat-panel heat pipe integrated package (COFB) LED device. The company said that compared with domestic similar products, the LED device has high luminous efficiency and has no light decay for 6,000 hours of continuous operation.
It is reported that the LED package mode is divided into two types. Separated into the traditional mainstream mode of LED product packaging, but with the development of technology, LED integrated packaging is sought after by the market for its unique high-efficiency heat dissipation capability, and is expected to become the mainstream mode of LED packaging in the future. .
Compared with the traditional discrete packaging mode, the integrated package can save the cost of device packaging. In the application, the integrated module can make the lighting fixture production, installation and maintenance more simple and convenient, and modularization makes it possible to interface with the traditional lighting fixture. In production, saving labor and time, with the existing process technology and equipment can fully support the high-quality manufacturing of high-yield modules.
It is reported that the LED package mode is divided into two types. Separated into the traditional mainstream mode of LED product packaging, but with the development of technology, LED integrated packaging is sought after by the market for its unique high-efficiency heat dissipation capability, and is expected to become the mainstream mode of LED packaging in the future. .
Compared with the traditional discrete packaging mode, the integrated package can save the cost of device packaging. In the application, the integrated module can make the lighting fixture production, installation and maintenance more simple and convenient, and modularization makes it possible to interface with the traditional lighting fixture. In production, saving labor and time, with the existing process technology and equipment can fully support the high-quality manufacturing of high-yield modules.
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