According to foreign media reports, IBM and 3M plan to jointly develop adhesives to package semiconductors into densely stacked chip towers, the so-called 3D packages. Using this chip will increase the speed of smartphones, tablets, computers, and gaming devices.
The goal of the two companies is to create a new class of materials. This material may be manufactured with a commercial microprocessor consisting of 100 individual chips.
Processors tightly packed with memory and network components can produce computer chips that are up to 1,000 times faster than today's fastest microprocessors.
According to the cooperation agreement, IBM will help package semiconductors. 3M will develop and produce adhesive materials.
The goal of the two companies is to create a new class of materials. This material may be manufactured with a commercial microprocessor consisting of 100 individual chips.
Processors tightly packed with memory and network components can produce computer chips that are up to 1,000 times faster than today's fastest microprocessors.
According to the cooperation agreement, IBM will help package semiconductors. 3M will develop and produce adhesive materials.
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