The agreement signed by the two companies in October 2010 helped Audi to introduce a range of innovative in-vehicle features and optimization features based on National Semiconductor technology. Previously, the cooperation between the two companies successfully used National's FPD-Link in-vehicle infotainment solution in all Audi models. On this basis, the results of this agreement will be first seen in the Audi A3, which began production in 2012, and will be expanded to other Audi models in the next few years.
Audi is known for its state-of-the-art interior design and the most intuitive and user-friendly user interface. The user desires that the entertainment information can be accurately positioned at the most desired line of sight, and the control elements can also be within reach of the driver or passenger. This philosophy and attention to detail throughout the entire design process of Audi's multimedia interface (MMI®) infotainment also directly affects its choice of chipset.
Audi partnered with National Semiconductor engineers to select National's FPD-Link III Ser/Des automotive infotainment chipset. The chipset can distribute uncompressed high-definition video from the Audi MMI central processing unit throughout the front and rear high-resolution displays. And by implementing a truly protected digital signal, its content (such as Blu-ray movies or 3D map data) is guaranteed not to be attacked or penetrated by hackers.
National's FPD-Link III Ser/Des chipset leverages the company's many superior technologies, including high-speed analog and mixed-signal technology, high-definition digital video, audio, clock transmission technology, and implementation on a twisted pair. Content protection encryption key exchange technology. At the same time, the technology used in the FPD-Link III chipset is one of the few technologies selected by Digital Content Protection (DCP LLC). DCP LLC is an authorized organization for high-bandwidth digital content protection (HDCP)-certified HDCP technology.
Robert Hinke, vice president and general manager of National Semiconductor Europe, said: "The speed and integrity of electronic signals are critical to automotive infotainment applications. Our high-performance analog innovations make us an ideal partner for Audi. We look forward to Further cooperation, using technology and innovation to help Audi launch a new generation of cars."
Dr. Peter Steiner, Head of Audi Info & Entertainment, added: "Through this collaboration, we will continue to develop cost-optimized solutions for the goal of providing high-quality HD digital video for Audi cars. National Semiconductor's System Integration Expertise And the flexibility of supporting interface solutions, coupled with Audi MMI's industry-leading graphics processor, provides a strong guarantee for this."
The FPD-Link III series is not only suitable for infotainment systems, but also includes automotive-grade chipsets for Audi driver-assisted cameras. This technology improves driver safety and response time, helping drivers monitor road conditions, identify hazards and avoid collisions.
National Semiconductor Corporation
National Semiconductor is a leading developer of power management technologies and is committed to providing the market with easy-to-use analog integrated circuits and world-class supply chain management technology and experience. The company's high-performance analog products can improve the energy efficiency of their systems. Headquartered in Santa Clara, California, National Semiconductor has a turnover of $152 million in fiscal year 2010.
Emphasis: Because of the market chaos and the cheating of bad dealers, most people simply don't understand USB 3.0 and USB 3.1. USB 3.1 Gen1 is USB 3.0. And USB 3.1 Gen2 is the real USB 3.1. The maximum transmission bandwidth of USB 2.0 is 480 Mbps (i.e. 60MB/s), USB 3.0 (i.e. USB 3.1 Gen1) is 5.0 Gbps (500MB/s), and USB 3.1 Gen 2 is 10.0 Gbps (although the nominal interface theoretical rate of USB 3.1 is 10Gbps), but it also retains some bandwidth to support other functions, so it has a good performance. The actual effective bandwidth is about 7.2 Gbps. USB 2.0 is a four-pin interface, and USB 3.0 and USB 3.1 are nine-pin interfaces.
USB 3.1 is the latest USB specification, which was initiated by big companies such as Intel. Compared with the existing USB technology, the new USB technology uses a more efficient data encoding system and provides more than twice the effective data throughput (USB IF Association). It is fully downward compatible with existing USB connectors and cables.
USB 3.1 is compatible with existing USB 3.0 software stacks and devices
USB3.1 LOGO
USB3.1 LOGO
Protocol, 5Gbps hubs and devices, USB 2.0 products.
Intel, which owns Thunderbolt technology, also welcomes the formation of the USB 3.1 standard. USB 3.1 contains most of the features of USB 3.0 [2]. USB 3.1, as the next generation of USB transmission specifications, is commonly referred to as "SuperSpeed+", which will replace USB 3.0 in the future. [3]
USB 3.1 C SMT FINISHED,DIP USB3.1 Plug,Vertical USB Connector,USB Type-c Receptacles Shell
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