[PConline News] Micron has officially started shipping its highest-capacity and fastest server-class memory module, featuring a 128GB capacity and DDR4-4266 LRDIMM specifications. This high-performance memory module comes with a hefty price tag of $3,999, which translates to approximately RMB 26,500.
The new memory is built using Micron's 8Gb DRAM IC chips, utilizing TSV (Through-Silicon Via) 4Hi stacking technology along with a 20nm manufacturing process. To achieve the high frequency of DDR4-4266, the timing has been relaxed to CL22, and it operates at just 1.2V, making it both efficient and powerful. However, this "premium" memory isn't cheap—its production involves 34 independent manufacturing steps, over 100 rigorous tests and verifications, and the overall cost is significantly driven up by the complexity of the process.
This advanced memory is compatible with both AMD EPYC and Intel Xeon processors, with particular optimization for Intel's latest scalable Xeon lineup. On dual Xeon platforms, it can support up to 1.5TB of memory, while the EPYC platform can handle up to 2.0TB. While such high-end memory is primarily aimed at enterprise and data center applications, it’s fascinating to see how tech enthusiasts and power users will leverage this cutting-edge hardware in their own systems. Whether it's for AI research, high-performance computing, or large-scale virtualization, this memory represents a significant leap forward in server-grade technology.
BLPS laser safety protective device is designed for personal safety used on hydraulic bender.
The dynamic test technology it used has passed the Type 4 functional safety assessment by TUV, and get the national invention patent. The product reaches the advanced technological level of similar products.
BLPS laser safety device provides protection zone near the die tip of the bender to protect fingers and arms of the operator in close to the upper mold die tip. It is the most effective solution so far to preserves the safety and productivity of the bender.
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