Recently, China Resources Shanghua released the newly developed BCD process platform. At the same time, the 8-inch production line with its 19% stake also introduced a variety of new BCD and 0.13-micron process platforms to meet customers' AC-DC converter circuits such as off-line power supplies and LED lighting drivers. High voltage, high efficiency and high integration. Demand for the application market.
Based on the original BCD process, CSMC has developed three new BCD process platforms of 1.0 micron 700V, 0.25 micron and 0.18 micron for high voltage, high performance and high integration applications of green energy-saving products.
The 1.0 micron 700V BCD process platform was developed based on the integration of 700V DMOS on the 1.0 micron 40V BCD process platform widely used in AC-DC converters by CSMC. It not only maintains the simple economy of the original process, but also expands the application range, mainly used in AC-DC conversion circuits such as offline power supply and LED lighting drive.
The 0.25-micron BCD process platform newly developed by the 8-inch production line has a 30% improvement in power DMOS performance compared to the original 0.5-micron BCD process platform. The process flow is simplified and the cost of use is lower. The process platform is targeted at power management applications such as DC-DC converters, AC-DC converters, LED drivers, audio amplifiers, and battery protection. And provide more process options, allowing customers to flexibly choose the device they need to optimize the chip design.
At the same time, the 8-inch production line also introduced a 0.18-micron BCD process platform, embedding the power DMOS into the 0.18-micron digital platform, maintaining the original performance of the 0.18-micron digital process and the 0.25-micron BCD process, providing a complete digital standard cell library, OTP design, etc. stand by.
In addition, based on the original 0.18 micron process platform, the 8-inch line also introduces its newly developed 0.13-micron process platform, including 0.13 micron logic, analog and RF process platforms. Compared to 0.18 micron technology, the 0.13 micron technology can reduce the chip size by up to about 50% and improve performance by more than 50%. CSMC's 0.13-micron process platform is highly compatible.
CSMC is currently a large 6-inch open epitaxial wafer foundry in mainland China with more than 100,000 pieces of 6-inch epitaxial wafers per month. The 8-inch epitaxial wafer foundry jointly invested by China Resources Group has 30,000 8-inch epitaxial wafer production capacity, and will reach 60,000 in 2012.
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