Ian Steff, the deputy assistant director of the U.S. Department of Commerce responsible for manufacturing, recently visited TSMC's headquarters to meet with Zhang Zhongmou, the chairman of TSMC. The meeting has sparked significant interest from the global media and industry observers, as it comes at a critical time for the semiconductor sector. Speculation is growing about the potential outcomes of the discussions, with three main scenarios being considered: TSMC potentially establishing a factory in the U.S., increasing support for American IC design companies, and how TSMC plans to navigate the ongoing U.S.-China trade tensions.
Recent developments in the Sino-U.S. trade war have seen some delays, but reports suggest that mainland China may be shifting its semiconductor procurement away from Taiwan and South Korea toward the U.S. This shift has raised concerns about the potential impact on Taiwan’s semiconductor industry, which plays a vital role in the island’s economy and national GDP. Given this context, Ian Steff’s visit to TSMC has led to increased speculation about the future of U.S.-Taiwan semiconductor collaboration.
Sun Youwen, a senior director at TSMC’s Corporate Information Office, confirmed that Zhang Zhongmou met with Steff on the morning of the 26th to exchange views. While the details of their conversation remain undisclosed, industry insiders believe the discussion likely focused on the relationship between the U.S. and Taiwan’s semiconductor sectors, as well as strategies to manage the effects of the U.S.-China trade war.
Since President Trump took office, the U.S. has emphasized policies promoting domestic manufacturing and prioritizing American interests. This includes the ongoing trade war with China. In this environment, companies like Hon Hai (Foxconn) have already begun setting up U.S. facilities. With this model in place, many in the industry are wondering if TSMC could follow suit, potentially becoming the next major "Made in America" semiconductor manufacturer.
Additionally, TSMC’s key clients, such as Apple and Qualcomm, are American companies. There is hope that TSMC might expand its production capabilities within the U.S. to better serve these customers.
Another possible scenario is that TSMC may increase its capacity support for U.S. IC design firms. As semiconductor technology advances to 7nm and beyond, the technical barriers are extremely high. Currently, only a few manufacturers—such as Intel, TSMC, and Samsung—are capable of producing cutting-edge chips. With the rapid growth of AI and automotive electronics, the demand for high-end semiconductors is expected to rise significantly. Industry experts believe that TSMC may be encouraged to provide more support to U.S. chip designers in the coming years.
The third possibility involves Zhang Zhongmou’s perspective on the U.S.-China trade war and how TSMC intends to protect Taiwan’s semiconductor industry from negative impacts. It also raises questions about how to maintain the long-standing friendly relationships between U.S. and Taiwanese semiconductor companies amid rising geopolitical tensions.
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