With the increasing popularity of flip-chip LED light sources in the market, more people are becoming familiar with this technology. However, many still don’t fully understand what a flip-chip actually is. Don’t worry—let me take you through it step by step and explain everything clearly.
In traditional LED structures, both the p and n electrodes are located on the same side of the chip, which can lead to current crowding and higher thermal resistance. The flip-chip structure effectively addresses these issues, allowing for higher current density and better light uniformity. Beyond material costs, stability and light efficiency are key factors for future LED applications. Flip-chip technology not only meets these demands but also offers versatility across various power levels. While dressing technology is commonly used for small and medium power LEDs, flip-chip technology has two main types: one uses a sapphire substrate for heat dissipation, though it doesn’t significantly increase current density, while the other removes the substrate entirely, greatly enhancing current density.
The term “flip-chip†comes from its contrast with the traditional gold wire bonding method. In conventional setups, the chip’s electrode faces upward and connects to the substrate via gold wires. In a flip-chip, the electrode faces downward, as if the chip has been flipped over, hence the name “flip-chip.â€
As LED technology matures, competition becomes fiercer. Flip-chip LED technology has gained attention in recent years due to its excellent heat dissipation and gold-free design, even though it comes at a higher cost. This makes COB an attractive option for the market.
Today, flip-chip COB is gradually being adopted by major packaging companies. It seems to be an inevitable trend that the industry will shift toward flip-chip technology, replacing traditional methods. But why is the traditional approach still dominant? Let’s hear what industry experts have to say.
Flipping COB to replace traditional COB is becoming a trend in the narrow market segment. Currently, flip-chip isn’t much better than traditional COB in terms of performance, and the price is almost the same. Market recognition is still limited, and secondary optics haven’t fully matured, resulting in a brightness drop of about 10–12% compared to traditional COB. Even though same-side LED technology can achieve less than 8% loss, there are still challenges to overcome.
According to Huang Wenping, director of Same Party Optoelectronics, at the same price, smaller flip-chip sizes result in lower brightness. However, when the size is the same, flip-chip has higher brightness because it reduces front-side light absorption. Overall, the current cost-performance ratio of flip-chip COB isn’t very strong, so it remains a niche product for now. But it’s definitely a growing trend that will eventually replace traditional COB and offer better brightness, thanks to simpler processes and structures.
Zheng Haibin, deputy general manager and marketing director of Jiangxi Zhaochi Optoelectronics, also mentioned that some COB products are already mature and cost-effective. Flip-chip COB benefits from high current tolerance and no need for gold wires, reducing material and production costs. These advantages make it easier for flip-chip COB to gain market acceptance in the near future.
Lei Lining, general manager of Hongli Optoelectronics, believes the current market is divided into two ends: low-cost products that don’t require high light efficiency, and high-end products for specialized fields such as compact luminaire designs that demand high power and luminous flux output. Flip-chip COB has its own unique place in these scenarios.
Xia Xuesong, general manager of Silicon Energy Lighting, added that in the medium to long term, flip-chip technology is destined to dominate the market. Zou Yiming, general manager of Shenzhen Xinyueguang, also emphasized that as flip-chip light performance improves and prices continue to drop, the future market potential is huge.
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