Pyle Audio launches rear-mounted Bluetooth headset PHBT5

Pyle Audio has just launched a wireless headset called PHBT5. In terms of product color, PHBT5 also has a variety of options, very suitable for young users. This is a rear-mounted headset, worried about ordinary headset Headphones can mess up the hairstyle of the user or can be considered.
Pyle Audio launches rear-mounted Bluetooth headset PHBT5
For wireless connectivity, PHBT5 also uses Bluetooth pairing. Bluetooth-enabled mobile devices, including Android smartphones and iPhones, can be connected to this headset. In addition, a microphone is built into the headset to make it easy for users to answer calls. The built-in battery support for headphones is up to 10 Hourly call, and 180 hours of standby. It takes 2-3 hours for the headset to fully charge, and it can play music for 8 hours after each charge.
Pyle Audio launches rear-mounted Bluetooth headset PHBT5
PHBT5 supports simultaneous connection with 2 mobile devices, supports A2DP and AVRCP Bluetooth protocol, and the specification is 5.9×4.3×2.95 inches (about 15.0×10.9×7.5cm). The headset product is currently available, and the price is 39.99 US dollars (about 244 yuan) ).

Via In Pad PCB
What is Via In Pad? In shortly,via in pad is the via holes are at the SMD pad.The vias are very small,usually under 0.3mm.Why and how? First is there is no enough space to layout,you have to put the vias and holes closer even together.Second it helps thermal management and for high frequency boards,it may help improve signals.
Because the SMD pads are for SMD components loading,so the solder can not flow to inner layer or the other side when assemble.That is the most important for via in pad board.
How PCB manufacturers like us to do via in pad board? We will fill all vias with non-conductive epoxy and plate copper over it ,so the vias are flat same as others. Many PCB factories are unable to do such capability.
The key technology is how we fill vias and guarantee there is no any solder (surface finishing) in the holes.
Filled via in pad is a way to achieve intermediate density with an intermediate cost compared to using blind/buried vias. Some of the key advantages associated with using the via in pad technology are:
.Fan out fine pitch (less than .75mm) BGAs
.Meets closely packed placement requirements
.Better thermal management
.Overcomes high speed design issues and constraints i.e. low inductance
.No via plugging is required at component locations
.Provides a flat, coplanar surface for component attachment
Via in big pads are not a big problem.but for BGA,that is technology.As BGA pads are very small,10mil or 12mil,and there is no enough space.Manufacturing is not easy as other boards.

Via In Pad PCB

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Storm Circuit Technology Ltd , http://www.stormpcb.com

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